| 摘要 |
PURPOSE:To improve moisture resistance and reliability without loss of other various properties by sealing a semiconductor element with specific epoxy resin composition containing hydrotalcite compound and antimony pentaoxide. CONSTITUTION:A semiconductor element is sealed by using an epoxy resin composition containing epoxy resin, novolac phenol resin, butadiene-acrylonitrile copolymer having a carboxyl group or amino group at both ends of a molecule chain, hydrotalcite compound and antimony pentaoxide. Since it is sealed with such a composition, its internal stress is small, and since both anion and cation are collected by a trap agent in a sealing plastic package, its moisture resistance and reliability can be improved.
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