Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates

摘要

Disclosed is a liquid photosensitive resin composition comprising (a) an at least partially carboxyl-modified multifunctional epoxy acrylate and/or multifunctional epoxy methacrylate having an average acid value of 4 to 150 and a number average molecular weight of not greater than 5,000, (b) an acrylic and/or methacrylic cross-linking monomer and/or oligomer other than the epoxy acrylate and/or epoxy methacrylate, (c) an acrylic and/or methacrylic monoethylenically vinyl monomer, (d) an inorganic filler, and (e) a photo-initiator and/or photosensitizer. This liquid photosensitive resin composition has excellent alkali developability, yields a cured coating film having good adhesion and good electrical insulating properties under high-humidity conditions, and is suitable for use as a solder resist in the fabrication of printed circuit boards.