| 摘要 |
In a power sensor for RF power measurments, comprising a thin-film absorbing resistor formed on the top surface of a support member and a thermocouple which is electrically isolated from the circuit of said absorbing resistor, the absorbing resistor is formed on an insulating film of a silicon support member so as to increase the sensitivity and to facilitate manufacture thereof, the silicon support member including an island formed beneath the absorbing resistor, a thermally conducting portion formed in spaced relationship thereto with a narrow bridge portion provided inbetween, and said thermocouple being constituted by the bridge portion and by mutually spaced contact zones formed thereon.
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