发明名称 Method of and arrangement for cleaning, activating and metallizing of bore holes in conductor boards
摘要 Cleaning, activating and metallizing of bore holes in conductor boards is performed by supplying a liquid treatment medium in form a standing wave onto a lower side of the conductor board by a surge line which is formed as a nozzle arranged under a transporting path and substantially normal to a transporting direction of the horizontally guided conductor board.
申请公布号 US4789405(A) 申请公布日期 1988.12.06
申请号 US19860893563 申请日期 1986.08.04
申请人 SCHERING AKTIENGESELLSCHAFT 发明人 BLAESING, HORST;MEYER, WALTER
分类号 C23C18/16;B23P15/16;C23C18/31;C23C18/40;C25D5/20;H05K3/00;H05K3/24;H05K3/26;H05K3/42;(IPC1-7):B08B3/12 主分类号 C23C18/16
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