| 摘要 |
PURPOSE:To punch and form an electronic component with a small device and without a wasteful movement by installing the following: a first elevating means which constitutes a component-pressing state to press the electronic component against an upper mold; a second elevating means which raises and lowers a projected forming body and forms the punched electronic component. CONSTITUTION:If an electronic component 12 is set to component-setting parts 10 which are projected upward from an upper mold 1, a lower mold 6 is lowered; the upper mold 1 is then closed; the electronic component 12 is housed at the lower part of the upper mold 1 together with the lower mold 6. Then, the lower mold 6 is raised; circumferential sides of the set electronic component 12 are fixed; the fixed inside parts are cut by using a cutting part 19. In succession, a projected forming body 17 protrudes, and executes a forming operation at the punched electronic component 12. After that, the upper mold 1 is opened and the lower mold 6 is raised; the lowered electronic component 12 is guided to the upper part of the upper mold 1 where no obstacle exists; a finished product is transferred. By this setup, it is possible to set the electronic component 12 and to detach it at the upper part of the upper mold 1 whose movement is least wasteful.
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