| 摘要 |
The invention relates to an apparatus for ultrasonic wire bonding, whereby bonding loci can be interconnected by wire straps, by means of ultrasonic welding; in particular an apparatus in which bonding wire is guided and handled. According to the invention the bar (3) bearing the bonding head (2) has a longitudinal passage (4) in the direction of the ultrasound generator (35), which passage accommodates a guide tube (5) the upper end of which extends vertically upward out of the flange (6), near the rotational axis, and the lower end of which tube exits the bar (3) on an incline, in the outward direction, in the region of the mounting of the bonding head. A deflecting element (24) for the wire (40) is disposed above the upper end of the guide tube (5) and is not coupled with the rotational movement. The fact that the supply reel is mounted at a fixed location enables the employment of all customarily used type of reels, associated mounting means, and auxiliary elements for withdrawing the wire. |
