发明名称 RESIN MOULD BUSHING
摘要 PURPOSE:To improve the anti-cracking property and the airtightness-resisting property by furnishing the first layer consisting of a silicon rubber type adhesive on a central conductor and the second layer consisting of a heat-contracting material over the first layer, and heating. CONSTITUTION:The first layer 11 of a silicon rubber type adhesive tape furnished close to a central conductor 1 keeps the condition of a putty with no flowing-out even under a high temperature at 150 deg.C or more, and does hot lose the rubber elasticity even under a low temperature ambiance at -50 deg.C. As a result, a stress generated by the difference of the thermal expansion rate between the central conductor 1 and a pouring pattern layer 3 in a rapid heating and a rapid cooling can be relaxed sufficiently. Moreover, the first layer 11 contacts closely to the central conductor 1 and to the second layer 12 by the thermal contraction of the second layer 12 owing to its thermal contraction tape, maintaining the airtightness perfectly. Since the second layer 12 with the thermal contraction tape contacts rigidly to the whole body of the pouring pattern resin layer 3 by the chromic acid mixture solution treatment, the airtightness-resisting property is improved, and the anti-cracking property is secured generating no stress concentration on the pouring pattern resin layer 3.
申请公布号 JPS63298924(A) 申请公布日期 1988.12.06
申请号 JP19870129744 申请日期 1987.05.28
申请人 TOSHIBA CORP 发明人 KAGAWA YOSHIHIRO;KOYAMA MICHIHIKO;OYAMADA MITSURU
分类号 H01B17/26 主分类号 H01B17/26
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