发明名称 CERAMIC VESSEL FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce improper short-circuits due to scattering of brazing material and to improve the positional accuracy of a lead by forming a groove in a depth equal to one-half of the thickness of the lead in the lead mount of a ceramic vessel, and forming a metallized pattern with Ag-Pd paste or the like in the groove. CONSTITUTION:A groove 2 having a depth corresponding to the half of the thickness of a lead 4 to be attached is formed on a lead mount on the rear face of a vessel body 1, paste of Ag-Pd is printed and baked to form a pattern 3, and an external lead of kovar or 42-alloy is manufactured by brazing with Ag-Cu brazing material or the like. Thus, when the lead is brazed to the pattern, it can prevent a short-circuit between the patterns from occurring due to the flow or scattering of the brazing material, and the lead mounting accuracy is so provided as to braze to fall in the mounting pattern of the vessel.
申请公布号 JPS63299145(A) 申请公布日期 1988.12.06
申请号 JP19870134648 申请日期 1987.05.28
申请人 NEC CORP 发明人 SAKURAI FUMIO
分类号 H01L23/08;H01L23/50 主分类号 H01L23/08
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