| 摘要 |
PURPOSE:To easily assemble and constitute an electric component in a compact manner by a method wherein input and output terminals protruding toward the outside from a periphery of each multiple chip package are connected electrically in such a way that they are inserted into corresponding individual through holes at one bent and flexible wiring board and are then fixed. CONSTITUTION:After multiple chip packages 1 and the like have been prepared, flexible wiring boards 5 are mounted on protruding faces of support materials 2 of a substrate 3; multiple chip packages 1 and previously prepared buffer block materials 4 are arranged alternately in a multilayered manner on it in such a way that the support materials 2 pierce their through holes. That is to say, the flexible wiring boards 5 are bent to be a prescribed shape; at each stage where the multiple chip packages 1 are incorporated into the support materials 2 and arranged in a multilayered manner, input and output terminals 6 of the multiple chip packages 1 are inserted into prescribed through holes 5a on the flexible wiring boards 5 and then soldered. After a required multilayer structure has been formed, this structure is fixed collectively, e.g., by putting fixtures, e.g. screws 7', on tip parts of, e.g., the support parts 2. By this setup, a required electric component is constituted.
|
