| 摘要 |
PURPOSE:To improve the moisture resistance, reliability and thermal conductivity of a semiconductor device without deterioration of other various characteristics by sealing a semiconductor element with an epoxy resin composition containing epoxy resin, novolac phenol resin, silicone compound, hydrotalcite compound antimony pentoxide, and alumina component. CONSTITUTION:Epoxy resin (component A), novolac phenol resin (component B), silicone compound (component C), hydrotalcite compound (component D), antimony pentoxide (component E) and alumina (component F) are used, and the mixture is normally powderlike or tablet state obtained by tableting it. A semiconductor element is sealed with the epoxy resin composition. Excellent moisture resistance and reliability are obtained and a plastic package having high thermal conductivity is attained by using the components D, E and F, and a high reliability semiconductor device is obtained by using it.
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