发明名称 EQUIPMENT FOR FORMING FILM
摘要 PURPOSE:To prevent the deterioration of film quality caused by adhesion of suspended matters, by holding a substrate to be processed in a sate where the film-forming surface of the substrate to be processed is inclined downward by a specific angle from the vertical direction, and sending a reaction gas flow in the horizontal direction. CONSTITUTION:A substrate retaining part 12 holds a glass substrate 13 in the state where a film-forming surface is inclined downward by a specific angle, e.g., 20-70 deg. from the vertical direction. A reaction gas flow path 14a of opposing electrodes is constituted so as to form a nearly horizontal gas flow. Therefore, suspended matters in a processing chamber 11 are discharged from an exhausting flow path 15 outside the processing chamber 11, by the effect of gravity and the reaction gas flow. Thereby, the suspended matters can be prevented from adhering to the film-forming surface of the substrate 13, and deteriorating the quality of a thin film.
申请公布号 JPS63299323(A) 申请公布日期 1988.12.06
申请号 JP19870134610 申请日期 1987.05.29
申请人 TOKYO ELECTRON LTD 发明人 OKUMURA YUTAKA
分类号 H01L21/31;H01L21/205 主分类号 H01L21/31
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