| 摘要 |
<p>PURPOSE:To reduce a decrease in frequency characteristics due to leads and to allow the leads to be scarcely removed by providing each lead with a vertical part extending perpendicularly to each lead, forming package a so as to protrude at the end of the part from a lower face, and forming a section of the part protruding from the lower face of the package to become an external terminal. CONSTITUTION:A lead frame 5 is inserted into a package molding metal mold, and a package is molded with resin. Then, a high electron mobility transistor (HEMT) element 6 is pellet-bonded to the surface of an element disposing part in which the width of the horizontal unit 4b of a source lead 4 is narrowed, and perform wire bonding to connect the electrode pad of the element 6 to the leads 2, 3, 4 by the use of wirings 7, 7, 7, 7. Then, a cap 8 is secured to the package 1 to be sealed, and the frame 5 is cut at a section exposed from the outer face of the package 6 to obtain a HEMT.</p> |
