| 摘要 |
PURPOSE:To improve the integration degree by a method wherein an arrangement area of the integrated circuit on a substrate is provided with a shape smaller than the field size circle of a reduction projection exposure device and larger than the rectangle inscribed in this circle. CONSTITUTION:While the region 12 inscribed in a field size circle 11 has been used as a integrated circuit area, the region is further a region 13 shown with solid and slanting lines 13 is added to expand the region. Then, the substrate region 20 is made a square circumscribed with the circle in the field size region, and the integrated circuit region is made about the same size as the field size circle. Thus, it is made possible to improve the integration degree of an integrated circuit device with a currently used exposure device.
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