| 摘要 |
PURPOSE:To enhance adhesion to obtain a low-cost and high-performance thermal head which is superior in thermal efficiency, capable of being processed to be bent, and easy to shape small in size, by a method wherein the thermal head is provided with a metal substrate, a heat-resistant resin layer, and a large number of beat resistors and conductors, and the heat-resistant resin layer is formed by baking a specific polyimidine resin. CONSTITUTION:A thermal head is provided with a metal substrate, a heat-resistant resin layer formed on the metal substrate, a large number of heat resistors, and conductors connected to the heating resistors. The heat resistant resin layer is formed by baking a polyimidine resin shown by a general formula (1), where R1 represents at least one selected from among groups a, b, c, and R2 represents an aromatic diamine. The polyimidine resin shown by the general formula (1) is obtained by causing an aromatic diamine to react with an aromatic dibenzylidene in an organic solvent, such as N -methyl -2-pyrolidone, N,N'-dimethylacetamide, N,N'-dimethylformamide, m-cresol, and o-phenylphenol. After the polyimidine resin is applied on the surface of the metal substrate, it is heated for several hours at a temperature more than the softening point of the polyimidine resin, e.g., at a temperature of 200-400 deg.C, for drying the solvent and baked to obtain the heat-resistant resin layer.
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