| 摘要 |
PURPOSE:To carry out a bonding process outstanding in working efficiency and adhesive performance, by laminating a perforated double-sided adhesive tape on the surface of an adherend substrate and filling the holes with an adhesive followed by laminating an adherend thereon. CONSTITUTION:A perforated adhesive sheet consisting of a laminate pref. ca. 50mu-30mm thick made up of a release sheet and adhesive layer 3 is laminated on the surface of an adhesive substrate 6 followed by coating an adhesive 7 thereon the fill the holes 4 with said adhesive 7. Thence, the release sheet is peeled off followed by laminating an adherend 8 consisting of e.g. decorative material in place of said release sheet to effect lamination of the substrate 6 and adherend 8 into integration, thus accomplishing the objective bonding process.
|
