| 摘要 |
A method of forming a film (21) on a specific portion of a substrate (4-1) comprises irradiating the specific portion with a focused ion beam (3), and directing onto the specific portion material which will be caused by the focused ion beam (3) to form the film (21), the latter having a fringe (22) on at least one side thereof, characterised in that the or each fringe (22) is then selectively removed. |
