| 摘要 |
PURPOSE:To prevent a short-circuiting between adjacent patterns due to creamsolder oozing-out during the mounting of parts by a method wherein adhesive agent is applied after a cream-solder printed or applied on a printed circuit board is dried superficially, where parts are fixed temporarily by the adhesion of the adhesion agent and thereafter a flow-soldering is performed through heating. CONSTITUTION:A cream-solder 53 is printed on a printed wiring substrate 51 by a screen printer 41, and next the surface of the printed cream-solder 53 is dried in a drying oven 42, where flux of the solder surface 61 is dried and therefore inactive, but enough flux for soldering parts is left active inside the cream-solder 53. Therefore, an adhesive agent 71 is applied just before mounting the parts which are temporarily fixed by the adhesion of the adhesive agent 71, and then a flow-soldering is performed through heating. By these processes, a short-circuiting between adjacent patterns can be prevented which is caused by the contact of adjacent patterns due to the oozing-out of the cream- solder.
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