| 摘要 |
PURPOSE:To eliminate a short-circuit between circuits, the loss of smoothness and the problem of appearance by a method wherein a solder resist is formed on at least through holes other than through holes, wherein conductor pins are fixed. CONSTITUTION:A solder resist 6 is formed on through holes 4a other than through holes 4 for fixing conductor pins 7. Accordingly, when the pins 7 are fitted into the through holes 4 and are fixed with a solder, no solder is adhered to the holes 4a other than the holes 4 for fixing the conductor pins. That is, even in case a substrate 9 for mounting a semiconductor is dipped into a solder tank, a fused solder does not rise from the holes 4a, wherein the pins 7 are not inserted and fixed. Thereby, a short-circuit between circuits due to adhesion of a solder, the loss of smoothness and the problem of appearance are not generated.
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