发明名称 RESIN SEALED PACKAGE AND MANUFACTURE THEREOF
摘要 PURPOSE:To prevent shortage of sealing resin and to completely seal sides of a substrate to be sealed, by making a depth of a resin sealed package become larger than an addition of thickness of the substrate to be sealed to that of the sealing resin. CONSTITUTION:A depth of a cap 13 of a resin sealed package is made larger than an addition of thickness of a substrate to be sealed 12 to that of sealing resin 2. Namely an edge part of the cap 13 is projected more largely than a bottom plane of a substrate 12. Even if resin 2 is supplied excessively into the cap 13, the resin 2 does not leak from the cap 13. When the substrate 12 is inserted into the cap 13 and then the vacuum deforming is performed to remove the resin 2, end when the substrate 12 is pressed on the side of the cap 13, the resin 2 does not leak from the cap 13, so that shortage of the resin 2 can be prevented. Accordingly side planes 11 of the substrate 12 are sealed completely with the resin 2.
申请公布号 JPS63296253(A) 申请公布日期 1988.12.02
申请号 JP19870129754 申请日期 1987.05.28
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 SUZUKI TAKEKAZU;KODAMA HIDEO
分类号 H01L23/28 主分类号 H01L23/28
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