| 摘要 |
PURPOSE:To reduce the fraction defective of molding at the time of resin molding by a method wherein second plane parts retreated from the lower surface part of a resin-sealing part are provided on the peripheries of the end parts of the lower surface part. CONSTITUTION:A semiconductor element 31 is mounted on a lead frame, is resin-sealed and thereafter, outer leads 33 of the lead frame are bent in a J form. Moreover, second plane parts 37 retreated from a lower surface part 38 of a resin-sealing part 36 are provided on the peripheries of the end parts of the lower surface part 38. As the plane parts 37 are constituted without irregularity, irregularities are reduced in a metal mold for resin molding. Thereby, defective moldings are decreased. Moreover, a cleaning becomes easy to execute at the time of assembly of a printed circuit board.
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