| 摘要 |
PURPOSE:To form an air bridge wiring easily without deterioration in degree of integration, by making a feeding power source line part inclusive of an air bridge wiring and an inner wiring part provided with selective gold plating. CONSTITUTION:First layer wirings 102, 103 are formed on a semiconductor substrate 101, and an interlayer insulating film 104 is formed on the whole surface of the substrate. Next a contact hole 105 is formed. Afterwards lithography processing is used to form a photosensitive polyimide film, which serves as a supporting stand 106 of an air bridge, selectively on the film 104. Next a feeding layer 107 is formed and selective gold plating is performed to form an internal wiring part 109 and a feeding power source line part 108 inclusive of an air bridge wiring. Only the power source part 108 inclusive of the air bridge wiring is provided with gold plating. An unnecessary part of the layer 107 is removed by etching and then photosensitive polyimide of the supporting board 106 is removed, so that formation of the air bridge is completed.
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