摘要 |
PURPOSE:To prevent a stress applied to the pressure inlet of a package part from being transmitted to the pressure inlet of a sensor part by a method wherein the pressure inlet of the sensor part is connected to the pressure inlet of the package part with a flexible connecting member. CONSTITUTION:The part of a package case 3 to which a hybrid circuit board 2 is attached with bonding resin 5 is elevated to keep a sensor pipe 8 far enough not to be inserted into a package pipe 9 and the sensor pipe 8 is connected to the package pipe 9 with a flexible connecting member 4 while the space between the pipes 8 and 9 are sealed with the member 4. With this constitution, a stress applied to the pressure inlet provided in the package part 3 in which the sensor part 1 is housed is not transmitted to the sensor pipe 8 of the sensor part 1 so that the degradation of the characteristics of the sensor part 1 can be avoided.
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