发明名称 METHOD OF MOUNTING COVER MEMBER FOR INSULATION SEAL TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To enable the sure mounting of a cover member on an insulating substrate, by using two magnetic materials to hold the cover member and the insulating substrate pressingly in a heating atmosphere and using a permanent magnet as at least one of both these magnetic materials. CONSTITUTION:A brazing material is placed between an insulating substrate 1 and a covey member. In succession, these are pressed and moved in a heating atmosphere to melt the brazing material 4. When the substrate 1 and the cover member 3 are moved in the heating atmosphere, they are held pressingly by permanent magnets 11, 12 and cooled afterwards. The cover member 3 is thus mounted on the substrate 1. Since two uniform pressing forces can be applied in the direction opposite to each other perpendicularly to the cover member 3 on the substrate 1, the cover member 3 can be surely mounted on the substrate 1.
申请公布号 JPS63296249(A) 申请公布日期 1988.12.02
申请号 JP19870134295 申请日期 1987.05.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 UEDA NAOTO
分类号 H01L23/02 主分类号 H01L23/02
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