PROTECTIVE SHEET FOR WAFER GRINDING; GRINDING OF WAFER FACE USING SAID SHEET

摘要

PURPOSE:To remove an adhesive adhered to the surface of a wafer by washing it by water after a grinding operation has been completed by forming a layer of the prescribed adhesive on the surface of a substrate. CONSTITUTION:A protective sheet 1 for wafer grinding use is composed of a substrate material 2 and a layer 3 of an adhesive coated on the surface of this material. This layer 3 of the adhesive contains at least the following: a partially cross-linked substance of a hydrophile polymer containing a carboxyl group whose one part is neutralized partially; an anion surfactant and a cation surfactant. By this setup, it is possible to remove the adhesive adhered to the surface of a wafer by washing it by water without using an organic solvent such as Triclene or the like after a grinding process has been completed.