发明名称 PRINTED CIRCUIT BOARD FOR IC CARD
摘要 PURPOSE:To prevent the outflow of an inexpensive conductive paste even if used so as to attain a sure connection and obtain a substrate low in cost by a method wherein the connection of the substrate with its rear and front faces both consisting of conductor is made with the conductive paste filled in a recessed part which is covered with a conductor of an external connecting terminal face side. CONSTITUTION:Holes are provided on a substrate 12 wherein only one surface thereof a metallic film has been formed thereon, and thereafter a metallic film is formed on the other surface on which a metallic film has not been built, and then external connecting terminals 11 and conductive circuits 13 are formed through etching to close the holes. Then, a conductive paste such as copper paste and the like 14 is filled into a recessed part 15, through printing, dispenser or the like and then hardened. As mentioned above, the connection of a sub strate with its rear and front faces consisting of conductor is made through the recessed part 15 of which one side is closed with a conductor of an external connecting terminal side, thereby outflow of the paste is prevented even if an inexpensive paste is used and therefore a substrate can be improved in reliability.
申请公布号 JPS63296387(A) 申请公布日期 1988.12.02
申请号 JP19870132690 申请日期 1987.05.28
申请人 IBIDEN CO LTD 发明人 HORIBA YASUHIRO;HIROI ATSUSHI
分类号 H05K1/11;B42D15/10;H05K3/40 主分类号 H05K1/11
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