发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To provide the title compsn. comprising a novolak epoxy resin as the base resin and having a reduced stress without decreases in moisture resistance and mechanical characteristics, by using therein a specific flexibilizer. CONSTITUTION:In an epoxy resin compsn. comprising as the base resin a novolak epoxy resin, and as the other essential components a flexibilizer, a curing agent, a curing promotor, a coupling agent and an inorg. filler, polybutadiene having reactive carboxyl groups at its terminals is used as the flexibilizer in the form of a powder prepared by milling the flexibilizer into the base resin, causing the milled mass to gel with the curing agent and the curing promotor to lose the reactivity thereof, and pulverizing the resulting gel. This can provide a compsn. having a reduced stress without decreases in the moisture resistance and mechanical characteristics thereof.
申请公布号 JPS63295626(A) 申请公布日期 1988.12.02
申请号 JP19870130333 申请日期 1987.05.27
申请人 FUJITSU LTD 发明人 MATSUURA AZUMA;NISHII KOTA;TAKIGAWA YUKIO;NAKADA YOSHIHIRO
分类号 H01L23/29;C08G59/00;C08G59/18;C08G59/42;C08L63/00;H01L23/31 主分类号 H01L23/29
代理机构 代理人
主权项
地址