发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要 PURPOSE:To provide an epoxy resin compsn. comprising a novolak epoxy resin as the base resin and having a reduced stress without decreases in moisture resistance and mechanical characteristics, by blending the base resin with butadiene and silicone flexibilizer in combination. CONSTITUTION:In an epoxy resin compsn. comprising as the base resin a novolak epoxy resin, and as the other essential components a flexibilizer, a curing agent, a curing promotor, a coupling agent and an inorg. filler, butadient and silicone flexibilizer are blended in combination in amounts of 1-25pts.wt. and 1-10pts.wt., respectively, per 100pts.wt. base resin.
申请公布号 JPS63295623(A) 申请公布日期 1988.12.02
申请号 JP19870130329 申请日期 1987.05.27
申请人 FUJITSU LTD 发明人 MATSUURA AZUMA;NISHII KOTA;TAKIGAWA YUKIO;NAKADA YOSHIHIRO
分类号 H01L23/29;C08G59/00;C08G59/18;C08L63/00;H01L23/31 主分类号 H01L23/29
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