发明名称 CONDUCTIVE MOLDING PLATE AND ITS MANUFACTURE
摘要 PURPOSE:To obtain a conductive molding plate having conductivity in the plate thickness direction by making an electric ratio resistance to be below a specified value with a thermosetting resin and carbon powder made to be contained with communicated in the thickness direction of a porous sheet in the sheet of an organic or ceramic fiber. CONSTITUTION:After a mixed liquid of a conductive filler and thermosetting resin is made to be contained in a chemical resistant porous sheet having an insulation tendency, the resin is hot set. The sheet used has gaps communicated necessary to have conductivity in the vertical direction on the surface of a molding plate. Such gaps are made to be a conductive path extending in the plate thickness direction of the molding body with a carbon filler together with a thermosetting resin filled, also to be a supporting part holding the resin by a surface tension when the resin is contained. When a quantity of a carbon powder is 50-75 weight % to that of the resin, an electric ratio resistance obtained in the plate thickness direction of the molding plate is below 10OMEGAcm and a bending strength is more than 800 kg f/cm<2>, and a sufficient characteristics as a separator of a fuel cell and new secondary battery can be obtained. This enables the required conductive molding plate to be manufactured.
申请公布号 JPS63294610(A) 申请公布日期 1988.12.01
申请号 JP19870128441 申请日期 1987.05.27
申请人 SHOWA DENKO KK 发明人 MURAKAMI SHIGERU;UEMURA TAKEO;INOUE HITOSHI
分类号 B29B15/10;B29C43/02;B29K101/10;B29K105/06;B29K105/16;B29L7/00;H01B1/24;H01B5/16;H01B13/00;H01M4/96;H01M8/02;H05K9/00 主分类号 B29B15/10
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