发明名称 COMPOUND SUPERCONDUCTION STABILIZING THIN PLATE AND ITS MANUFACTURE
摘要 PURPOSE:To enable a compound superconduction stabilizing thin plate having a wide width costlessly by providing a copper-tin or copper-gallium alloy layer, a superconductor layer composed of niobium or niobium-titanium or vanadium, and a stabilizing metal layer composed of metal good conductors of copper, silver, aluminum etc. CONSTITUTION:Niobium (or niobium containing a small quantity of titanium) 2' and 3' are explosively bonded in both sides of a copper-tin (tin density of 5-15 weight %) alloy 1'. Or vanadium is explosively bonded in both sides of a copper-gallium alloy (gallium density of 10-20 atomic density). Furthermore, metal good conductors 4, and 5, for stabilizing of copper, silver, aluminum, etc. are explosively bonded in both sides of a cladding material of niobium/ copper-tin/niobium or vanadium/copper-gallium/vanadium formed in the first process. This enables a large thin plate to be easily obtained and a compound superconduction stabilizing thin plate obtained which has a good adherence between a superconduction layer and each stabilizing metal layer, and a good electric and thermal conductivity between the superconduction layer and the stabilizing metal layers.
申请公布号 JPS63294615(A) 申请公布日期 1988.12.01
申请号 JP19870128401 申请日期 1987.05.27
申请人 SHINKU YAKIN KK;OGASAWARA TAKESHI;MATSUBARA YOICHI 发明人 NOGUCHI TERUO;OKUBO HIROSHI;KODERA MASAHIRO;OGASAWARA TAKESHI;MATSUBARA YOICHI
分类号 H01B13/00;H01B12/02;H01F6/06 主分类号 H01B13/00
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