摘要 |
PURPOSE:To obtain an H2 permeable film causing no cracking by successively forming a thin Pd film and a thin Cu film by chemical plating on the surface of a heat resistant porous body and heat treating the films. CONSTITUTION:A thin Pd film and a thin Cu film are successively formed by chemical plating on the surface of a heat resistant porous body such as a sintered body of fine ceramic particles or porous glass. The formed films are heat treated at about 300-540 deg.C to diffuse Pd and Cu and to form a thin Pd-Cu alloy film. The resulting film has H2 permeability and does not cause cracking.
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