Infrared soldering furnace for reflow soldering of electronic components on printed circuit boards

摘要

In an infrared soldering furnace for reflow soldering electronic components on printed circuit boards 38 using a solder paste, said printed circuit boards rest on a support (support surface 37) which is transparent to infrared radiation. Infrared radiators 39-42 which heat the assembled printed circuit boards 38 during a heating phase and a melting phase at different temperatures are arraanged above and below the support. The printed circuit boards 38 are then cooled. A drawer 27 on whose support surface 37 the assembled printed circuit boards are placed is provided for introducing the assembled printed circuit boards 38 into the infrared soldering furnace. During the heating phase and the melting phase of the solder paste, the drawer is fixed in the housing. The infrared panel radiators 39-42 have a low thermal intertia and are arranged parallel to the support surface 37 at distances large enough to ensure they heat the support surface uniformly. The support or the support surface 37 and the infrared radiators 39-42 are arranged in a forced-draught exhaust-air duct 2 in the infrared soldering furnace. The infrared radiators 39-42 are powered by a time-controlled temperature control device 25 so that the stationary, assembled printed circuit boards are heated with the desired temperature profile. <IMAGE>