| 摘要 |
PURPOSE:To enable formation of dense and secure thin films by impressing high-frequency voltages between evaporated thin film forming material and substrate and between the thin film forming material and exciting plate, respectively, thereby ionizing the material. CONSTITUTION:A metallic bar 5 consisting of the thin film forming material is inserted into a filament 4 in a vacuum vessel 1 and the 1st variable high-frequency voltage is impressed between the vacuum vessel 1 and a substrate holder 7 from a high-frequency power supply 10 via a matching circuit 9. The 2nd variable high-frequency voltages are impressed between the vacuum vessel 1 and the exciting plates 12, 15 from high-frequency power supplies 14, 17 via matching circuits 13, 16. The filament 4 is energized by the impression of these two voltages to evaporate the metallic bar 5. The high-frequency voltage impressed on the exciting plates 12, 15 contribute largely to the ionization of the thin film forming material. The adhesion speed and impingement energy of the thin film forming material are thereby easily controlled.
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