发明名称 Semiconductor laser device and method for manufacturing the same.
摘要 <p>A semiconductor laser device comprises a substrate (10) having an n-type buffer layer (11), a semiconductor laser element and auxiliary element, provided side by side on the buffer layer. The semiconductor laser element includes a mesa portion having a p-type low resistant semiconductor region (13c) provided above the buffer layer, an active region (12a) consisting of a semiconductor formed on the buffer layer and low resistant region, a pair of buried portions (13a) integrally formed with the low resistive sregion and formed on and contiguous to opposite sides of the active region in the width direction. A lateral hole (35) is provided between the buffer layer and low sresistive region on the side of buried portion. The auxiliary element includes a high resistive regions (13d) integrally formed with the low resistant region and positioned on the sides of low resistive region.</p>
申请公布号 EP0293185(A2) 申请公布日期 1988.11.30
申请号 EP19880304737 申请日期 1988.05.25
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 MORINAGA, MOTOYASU C/O PATENT DIVISION;FURUYAMA, HIDETO C/O PATENT DIVISION;NAKAMURA, MASARU C/O PATENT DIVISION;SUZUKI, NOBUO C/O PATENT DIVISION;HIRAYAMA, YUZO C/O PATENT DIVISION;OKUDA, HAJIME C/O PATENT DIVISION
分类号 H01S5/02;H01S5/026;H01S5/042;H01S5/227;H01S5/323;(IPC1-7):H01S3/19;H01L27/15;H01L33/00 主分类号 H01S5/02
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