发明名称 |
Semiconductor laser device and method for manufacturing the same. |
摘要 |
<p>A semiconductor laser device comprises a substrate (10) having an n-type buffer layer (11), a semiconductor laser element and auxiliary element, provided side by side on the buffer layer. The semiconductor laser element includes a mesa portion having a p-type low resistant semiconductor region (13c) provided above the buffer layer, an active region (12a) consisting of a semiconductor formed on the buffer layer and low resistant region, a pair of buried portions (13a) integrally formed with the low resistive sregion and formed on and contiguous to opposite sides of the active region in the width direction. A lateral hole (35) is provided between the buffer layer and low sresistive region on the side of buried portion. The auxiliary element includes a high resistive regions (13d) integrally formed with the low resistant region and positioned on the sides of low resistive region.</p> |
申请公布号 |
EP0293185(A2) |
申请公布日期 |
1988.11.30 |
申请号 |
EP19880304737 |
申请日期 |
1988.05.25 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MORINAGA, MOTOYASU C/O PATENT DIVISION;FURUYAMA, HIDETO C/O PATENT DIVISION;NAKAMURA, MASARU C/O PATENT DIVISION;SUZUKI, NOBUO C/O PATENT DIVISION;HIRAYAMA, YUZO C/O PATENT DIVISION;OKUDA, HAJIME C/O PATENT DIVISION |
分类号 |
H01S5/02;H01S5/026;H01S5/042;H01S5/227;H01S5/323;(IPC1-7):H01S3/19;H01L27/15;H01L33/00 |
主分类号 |
H01S5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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