A system for cooling solid circuit components and a method for providing thermally conductive compound means therefor.

摘要

The cooling system comprises a cooling header and cooling modules connected to the cooling header. Each of the cooling modules engages a respective one of the components. The cooling module has a heat transfer plate (14) connected to one end of a bellows (13) which is connected to the cooling header (20) at the other end. A layer of thermally conductive compound (15), such as a layer of thermal grease, is interposed between the heat transfer plate and the corresponding circuit component. The thermally conductive layer is initially pressed with a pressure higher than a critical pressure, and thereafter, the pressure is reduced to a working pressure exerted to the circuit component and provided by the resilient force of the bellows and the hydraulic pressure of the coolant. The critical pressure is predetermined experimentally or practically. As a result, the thermal contact resistance between the heat transfer plate and the circuit component is favorably reduced and stabilized.