| 摘要 |
PURPOSE:To obtain a multi-layered circuit board having a conductor with lower seat resistance by a method wherein a specific conductive paste is used as the conductive paste for an inside layer circuit and the conductive paste for the most outside layer land section to improve the matching between the circuit conductor and board. CONSTITUTION:A conductive paste A for outside layer is printed as an outside layer land section 1 and an outside layer circuit section 2. The conductive paste A for the inside layer is printed as an inside layer land section 3 and an inside layer circuit section 4. The paste A is made with the mixing ratio of low resistance conductive powder 100 weight section, glass frit 0.5-10 weight section, organic binder 10-50 weight section, and suitable amount of solvent, and the softening temperature of the glass frit is lower than that of ceramic board material. The paste B is made with the mixing ratio of low resistance conductive powder 100 weight section, glass frit 0.5-10 weight section, organic binder 10-50 weight section and suitable amount of solvent, and the softening temperature of the glass frit is higher than that of ceramic board material. |
