| 摘要 |
PURPOSE:To form a dense and uniform plated film free from surface detects such as pinholes by sticking a reducing agent for a plating metal to the surface of a member to be plated, putting the member into a plating soln. and carrying out electroless plating. CONSTITUTION:The surface of a substrate of Al, an Al alloy or the like is degreased and subjected to zinc substitution treatment. The substrate is immersed in a soln. of a reducing agent such as sodium hypophosphate and the surface of a zinc film formed by substitution is activated. The substrate is then put in a plating soln. and electroless plating with Ni-P or the like is carried out. The reduction of ions of a plating metal during electroless plating is accelerated and a dense and uniform plated layer is formed. |
