| 摘要 |
PURPOSE:To recognize the position shift and inclination of a chip component and to perform flip chip bonding with high accuracy by picking up an image of the package surface of the chip component and finding the position of a bump. CONSTITUTION:An IC chip 12 is sucked by a mount head 11 from an IC chip supply part and moves onto a chip component recognizing device 1 with the surface of the bump 13 down, an optical system 14 projects a vertical parallel light beam 16 on the package surface of the chip 12, and a camera 15 picks up its image. Here, the optical axis of the camera 15 is adjusted and aligned with the optical axis of the light beam 16 and the center axis of the head 11, and the picked-up image is converted by an image processor with a proper threshold value into a binary signal so that the part of the bump 13 is black and other parts are white. Here, the image processor finds the position and inclination correction quantity at the time of the flip chip bonding of the chip 12 to a circuit board 12 from the relation among the position coordinates of the centers of gravity of three bumps 81, 82, and 83 among 16 bumps. |
