| 摘要 |
PURPOSE:To form a plated film having a uniform thickness on a wiring circuit board by conducting an electroplating so that a screening film having a mirror image of a reverse pattern of the circuit pattern is formed on the base surface and an electrode surface facing thereto so as to become the mirror image respectively. CONSTITUTION:A surface of a wiring circuit board alumina base plate 1-2 is roughened with a phosphoric acid solution, and after a Pd cell nucleus is fitted, is subjected to an electroless plating to form a thin copper layer. The screening film 1-3 having the reverse pattern of the circuit pattern 1-4 is formed on the surface of the base plate 1-2 and the plating electrode 1-1 facing thereto so that they become their mirror image. At that time, the end surface of the base plate 1-2 and the opposite side end surface of the electrode 1-1 are coated with a 'Mekki Resist(R)'. Subsequently, the base 1-2 and the electrode 1-1 are electroplated in a copper sulfate electroplating bath while facing their screening film formed surfaces 1-3 each other, after the copper plated layer having a uniform thickness is formed, lastly the screening film 1-3 on the base plate 1-2 is withdrawn, then the wiring circuit board is completed by withdrawing the thin copper layer under the screening film.
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