PASSIVE CIRCUIT DEVICE FOR MICROWAVE INTEGRATED CIRCUIT

摘要

PURPOSE:To drastically miniaturize the integrated circuit by forming a dielectric thin film on a ground conductor film provided to the upper surface of a semiconductor substrate and forming a microstrip line while forming the dielectric thin film as a new base. CONSTITUTION:A conductor film 15 and a ground conductor film 16 are formed to both sides via a linear gap 50 on the upper surface of the semiconductor substrate 4 with a ground conductor film 3 formed to the rear face, a dielectric thin film 17 is formed on the upper surface of the semiconductor substrate 4 with the upper surface of the ground conductor film 16 and the gap 50 formed thereupon and a square spiral conductor film 18 is formed on the upper surface. The conductor film 18 is connected to the conductor film 15 via a connection conductor film 19. The conductor films 15, 16 constitute a slot line and the conductor film 18 is a microstrip line using the conductor film 16 as a ground conductor. Thus, the dielectric thin film 17 is formed very thin and the width of the conductor film 18 is decreased, then the occupied area of the circuit is much reduced.