| 摘要 |
<p>A positive type photosensitive resinous composition which is specifically useful in a photoresist for printed circuit board, integrated circuit board and the like and in a lithographic plate is provided. The resinous composition is characterized by comprising a resin having in its side chains or at the end portions of main chain at least one iminosulfonate group of the formula: <CHEM> in which R1 and R2 each is selected from hydrogen atom, an alkyl, an acyl, a phenyl, a naphthyl, an anthryl and a benzyl group, or R1 and R2 may, taken together, form an alicyclic ring, the iminosulfonate content being 1.5 x 10<-><4> to 2.5 x 10<-><3> equivalent/g and the resin being free from glycidyl group or the like which may cause polymerization in the presence of sulfonic acid.</p> |
