| 摘要 |
The invention relates to a removal aid for mechanically detachable substrates adhering to a sheet-like, flexible carrier material and in the form of cuts or predetermined breaking lines in said carrier material. At least in the contact surface of the carrier material is provided for each substrate a separate, non-linear cutting or predetermined breaking line, so that when pressure is exerted on the carrier material with a force component in a direction at right angles to the substrate contact surface a carrier material portion with the substrate portion adhering thereto and bounded by the cutting or predetermined breaking line can be bent in the direction of the substrate or substrates, so that at least part of the substrate in the border area thereof adjacent to the cutting or predetermined breaking line is detached from the carrier material and consequently a gripping portion is formed on the substrate for the complete removal of the latter. |
