发明名称 Method for detecting and correcting failure in mounting of electronic parts on substrate and apparatus therefor
摘要 A method and apparatus for detecting and enabling correction of a failure in the mounting of electronic parts on substrates, capable of automatically and efficiently accomplishing the detection of a failure in the mounting of electronic parts on substrates, and classification between failed substrates and acceptable substrates to improve the overall operation efficiency of an electronic parts mounting line. The method is adapted to apply a code mark to each substrate on which electronic parts are to be mounted, detect a failure the mounting after, read and store the code marks and failure data of failed substrates, and classify the failed substrates from acceptable substrates and transfer the failed substrates on the basis of the code marks and failure data stored.
申请公布号 US4787143(A) 申请公布日期 1988.11.29
申请号 US19860865067 申请日期 1986.05.19
申请人 TDK CORPORATION 发明人 YAGI, HIROSHI;OHTA, MASANORI;SHUTOU, HIROKAZU;TSUJI, MASAMI
分类号 G01R31/265;H01L21/00;H05K13/08;(IPC1-7):H05K3/30;B23P19/00 主分类号 G01R31/265
代理机构 代理人
主权项
地址