| 摘要 |
PURPOSE:To assemble a semiconductor device accurately by placing a semiconductor element with a pattern face disposed downside in a semiconductor element positioning means provided on an assembling jig, coating the rear face of the element with an adhesive, and then covering the jig with the semiconductor package to fixedly bond the element. CONSTITUTION:An accurately formed semiconductor element recess 1a is formed on an assembling jig 1, and a semiconductor element 2 is placed in said recess 1a with a pattern face disposed downside. Then, the rear face of the element 2 is coated by a screen printing method with a conductive adhesive 3. Subsequently, a semiconductor package 4 made of ceramics is placed on the jig 1 along the guide 1b of the jig 1. Eventually, when the package 4 is raised and inverted upside down, the element 2 is accurately assembled at a predetermined position of the package 4 with the adhesive 3. |
