| 摘要 |
Disclosed is a heat pipe particularly suited for isothermal transfer of heat in high temperature, high pressure operation such as the growing of semiconductor crystals. The heat pipe has a stem communicating with its lower end, a cooler surrounding a portion of the stem, and an expansible bellows connected to the stem. The stem and the expansion chamber formed by the bellows accommodate displaced liquid working fluid to balance pressure within the heat pipe with ambient pressure outside the heat pipe. This avoids the need for complex, multi-layer structures or high strength materials in the heat pipe walls.
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