发明名称 CURING OF EPOXY RESIN
摘要 PURPOSE:To obtain a cured material having excellent hardness by curing an epoxy resin at high rate, by blending a liquid epoxy resin with THF in a specific ratio and irradiating the resin with radiation in the presence of a photo- cationic reaction initiator. CONSTITUTION:100pts.wt. liquid epoxy resin (preferably liquid bisphenol A glycidyl ether type) is blended with <=50pts.wt. THF, irradiated with radiation usually at 0.1-50Mrad dose in the presence of a photo-cationic reaction initiator (e.g. methoxyphenyldiazonium hexafluorophosphate) and the epoxy resin is cured. Electron rays from an accelerator is preferably used as the radiation.
申请公布号 JPS63291917(A) 申请公布日期 1988.11.29
申请号 JP19870125822 申请日期 1987.05.25
申请人 JAPAN ATOM ENERGY RES INST 发明人 OKADA NORIO;TAKEZAKI JUNICHI
分类号 C08G59/18;C08G59/00;C08K5/15;C08K5/1535;C08L63/00 主分类号 C08G59/18
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