发明名称 |
CURING OF EPOXY RESIN |
摘要 |
PURPOSE:To obtain a cured material having excellent hardness by curing an epoxy resin at high rate, by blending a liquid epoxy resin with THF in a specific ratio and irradiating the resin with radiation in the presence of a photo- cationic reaction initiator. CONSTITUTION:100pts.wt. liquid epoxy resin (preferably liquid bisphenol A glycidyl ether type) is blended with <=50pts.wt. THF, irradiated with radiation usually at 0.1-50Mrad dose in the presence of a photo-cationic reaction initiator (e.g. methoxyphenyldiazonium hexafluorophosphate) and the epoxy resin is cured. Electron rays from an accelerator is preferably used as the radiation.
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申请公布号 |
JPS63291917(A) |
申请公布日期 |
1988.11.29 |
申请号 |
JP19870125822 |
申请日期 |
1987.05.25 |
申请人 |
JAPAN ATOM ENERGY RES INST |
发明人 |
OKADA NORIO;TAKEZAKI JUNICHI |
分类号 |
C08G59/18;C08G59/00;C08K5/15;C08K5/1535;C08L63/00 |
主分类号 |
C08G59/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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