| 摘要 |
This invention relates to the production of glass-ceramic materials particularly suitable for use as substrates in integrated circuit packaging. The glass-ceramics can be prepared from thermally crystallizable glass capable of being concurrently sintered and crystallized in situ at temperatures between about 850 DEG -1000 DEG C to bodies exhibiting dielectric constants less than about 6, linear coefficients of thermal expansion between about 12-60X10<-><7>/ DEG C and containing cordierite solid solution as essentially the sole crystal phase. The glass-ceramics are essentially free from Li2O and Na2O and consist essentially, expressed in terms of weight percent on the oxide basis of 10-25% MgO + ZnO consisting of 2-18% MgO + 0-21% ZnO, 20-38% Al2O3, 40-52% SiO2, and 2-15% total of at least one oxide in the indicated proportion selected from the group consisting of up to 8% of an alkali metal oxide selected from the group consisting of K2O, Rb2O, and Cs2O, up to 10% of a divalent metal oxide selected from the group consisting of CaO, SrO, BaO, and PbO, and ZnO, and up to 5% B2O3. |
