发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a metal wire for connection which is bonded to an electrode by compression bonding from being contacted with other electrodes or wirings by providing a conductor pillow on which the metal wire is put near the bonding point of the electrode to which the metal wire is bonded. CONSTITUTION:Output side metal wires 5a and 5b and input side metal wires 8a and 8b are lifted up and stretched by a pillow 4 and pillows 7a and 7b respectively. If Au wires with a diameter of 30 mum are used as the output side metal wires 5a and 5b and the pillow 4, the distance between the output side metal wires 5a and 5b and a grounding side electrode 2 is 30-50 mum and the output side metal wires 5a and 5b are prevented from being brought into contact with the grounding electrode 2 even at a low temperature so that a reliability and a productivity can be improved.
申请公布号 JPS63291447(A) 申请公布日期 1988.11.29
申请号 JP19870126607 申请日期 1987.05.22
申请人 NEC CORP 发明人 NOGUCHI KAZUO
分类号 H01L23/50;H01L21/60;H01L21/603 主分类号 H01L23/50
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