| 摘要 |
PURPOSE:To detect the malfunction of placing, such as a lack, movement, displacement or standing of a component after all the components are placed on a substrate by providing an XY table commonly driven at the times of placing the component and inspecting the placing, and an area sensor type image recognition unit secured to the top of the table. CONSTITUTION:After a substrate is fed from an in-conveyor 1 to pass an in- buffer 2, it is secured to a position on a substrate B on an XY table 3, and a chip component is placed from a component attraction nozzle 5. Then, the placed substrate is moved to the position of a substrate A on the table 3 under an image recognition inspector, and the component placing state on the substrate is inspected here by using an image recognition camera 6. When defective components are found to exist by the inspection of the substrate A, the table 3 moves leftward to temporarily wait the substrate B at the buffer 2, the substrate A is moved to its placing position, and only the defective components are replaced. Thus, an accurate image recognition method can be employed to improve the recognition rate.
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