| 摘要 |
PURPOSE:To eliminate a place of soldering and to miniaturize a circuit pattern on a substrate by connecting the jumper of the circuit pattern formed on the substrate by an anisotropically conductive film without using soldering. CONSTITUTION:A circuit pattern 2 is printed by conductive ink on the upper surface of a flexible substrate 1. Then, an anisotropically conductive film 3 which contains conductivity imparting carbon fiber 3a in an insulating adhesive on the substrate 1 and the pattern 2. Then, a jumper circuit 4 is printed with the ink on the film 3. The circuit is so printed as to cover corresponding points 4a, 4b on the film 3 to connecting points 3a, 3b to be connected to the jumper of the pattern 2. Then, the points 4a, 4b are heat-pressed in directions of arrows E, F on the circuit 4. The adhesive between the point 2a of the film 3 and the point 4 is melted and removed by the heat-pressing, and the pattern 2 is electrically connected to the circuit 4 by the fiber 3a.
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