| 摘要 |
PURPOSE:To secure sufficient adhesive strength by constituting a metallized layer, to be installed in a substrate, mounting chip parts for an integrated circuit at high density, with a kneaded material consisting of copper oxide powder, whose wt.% is specified, and CuAl2O4 as well as an organic vehicle. CONSTITUTION:When a metallized layer is formed on a circuit board of alumina or the like, copper oxide powder of 85-99.5 wt.%, an inorganic component consisting of CuAl2O4 of 0.5-15 wt.% and an organic vehicle composed of an organic binder and an organic solvent are used as the metallized layer, and they are kneaded and thereby made into proper viscosity. If so, a manufacturing process of a copper multilayer substrate is promoted into yet lower temperature and shorter time and, what is more, such advantages as lowness of conductor resistance inherent in Cu, goodness of migration resistance, low cost, etc., can be brought into full play. |
